CMOS Image Sensor for Intraoral Dental
- Family of sensors with fine pitch, from 1.9 Mpixels, 30 fps to 9.2 Mpixels, 15 fps
- Patented, high dynamic range 6.5T pixel with 2×2 charge-domain binning
- Large full well (4M electrons) optimized for X-ray detection with a scintillator
- Camera-on-a-chip, with 14-bit column parallel ADC, and LVDS digital output
- Manufactured in a CIS 180 nm technology
Low Noise RGB Image Sensors
- 2.5 μm 4T pixel
- 1.8 e- rms noise
- HDR mode
- Flipping, mirroring, ROI readout
- Column parallel ADCs
- DVP output bus
- Manufactured in a CIS 110 nm technology
3-side buttable, wafer-scale sensor
- 100 µm pitch
- 4 megapixel
- wafer-scale image sensor
- 3-side buttable
- Dual-gain pixel
- Large full well
Large area, high speed 4Mpixel CIS
- 24 µm pitch
- 4MPixel
- Global shutter sensor
- dual-gain
- up to 500 frames per second
High-performance, visible-infrared CIS for space aplications
- 20 µm pitch
- 1Mpixel
- Global shutter pixel
- Hybrid, fully depleted sensor
- High quantum efficiency (>70%) from 450 to 900 nm
- Space-level radiation hardness
(In development under contract ESA AO/1-9801/19/NL/AR)
Low noise, 8µm pixel for medical and industrial applications
- 8 µm pixel
- 9 megapixel Back-Side Illuminated (BSI) sensor
- Rolling and global shutter at 30 fps in full frame
- Noise: 1.5 e- rms
- FW ≥ 65k
- DR ≥ 92.7 dB
- 12-bit column parallel ADC
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