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Designs

Custom development

CMOS Image Sensor for Intraoral Dental

  • Family of sensors with fine pitch, from 1.9 Mpixels, 30 fps to 9.2 Mpixels, 15 fps
  • Patented, high dynamic range 6.5T pixel with 2×2 charge-domain binning
  • Large full well (4M electrons) optimized for X-ray detection with a scintillator
  • Camera-on-a-chip, with 14-bit column parallel ADC, and LVDS digital output
  • Manufactured in a CIS 180 nm technology

Low Noise RGB Image Sensors

  • 2.5 μm 4T pixel
  • 1.8 e- rms noise
  • HDR mode
  • Flipping, mirroring, ROI readout
  • Column parallel ADCs
  • DVP output bus
  • Manufactured in a CIS 110 nm technology

3-side buttable, wafer-scale sensor

  • 100 µm pitch
  • 4 megapixel
  • wafer-scale image sensor
  • 3-side buttable
  • Dual-gain pixel
  • Large full well

Large area, high speed 4Mpixel CIS

  • 24 µm pitch
  • 4MPixel
  • Global shutter sensor
  • dual-gain
  • up to 500 frames per second

High-performance, visible-infrared CIS for space aplications

  • 20 µm pitch
  • 1Mpixel
  • Global shutter pixel
  • Hybrid, fully depleted sensor
  • High quantum efficiency (>70%) from 450 to 900 nm
  • Space-level radiation hardness

(In development under contract ESA AO/1-9801/19/NL/AR)

Low noise, 8µm pixel for medical and industrial applications

  • 8 µm pixel
  • 9 megapixel Back-Side Illuminated (BSI) sensor
  • Rolling and global shutter at 30 fps in full frame
  • Noise: 1.5 e- rms
  • FW ≥ 65k
  • DR ≥ 92.7 dB
  • 12-bit column parallel ADC